Daniel Josell

Daniel Josell is a group leader in materials science at the National Institute of Standards and Technology, where his research has illuminated fundamental aspects of interfacial thermodynamics and electrochemical material deposition. Josell earned both his undergraduate and doctoral degrees at Harvard, completing his doctorate in materials engineering with a dissertation on the determination of interfacial free energies by zero-creep experiments on multilayered thin films — precision thermodynamic measurements of the energy stored at interfaces between dissimilar materials. At NIST, he leads a research group whose work on superconformal electrodeposition of copper and other metals into high-aspect-ratio features has been central to the development of modern interconnect technology for integrated circuits.